8U Dual Socket AMD EPYC™ 9004 Series Processors 8x NVIDIA H100 SXM5 GPU
AceleMax® AXG-828GS
- Generative AI
- High Performance Computing
- Healthcare & Life Sciences
- Climate and Weather Modeling
- Finance & Economics
- Business Intelligence & Analytics
Specifications
| Component | Detail |
|---|---|
| Processor Support | Dual Socket SP5 AMD EPYC™ 9004 Series Processors (including AMD 3D V-Cache™ Technology) Up to 128C/256T Supports up to 400W TDP CPUs (Air Cooled) |
| GPU | Supported GPU: HGX H100 8-GPU SXM5 Multi-GPU Board CPU-GPU Interconnect: PCIe 5.0 x16 CPU-to-GPU Interconnect GPU-GPU Interconnect: NVIDIA® NVLink™ with NVSwitch™ |
| Memory | Memory Capacity: 24 DIMM slots Up to 6TB: 24x 256 GB DRAM Memory Type: 4800MHz ECC DDR5 RDIMM/LRDIMM |
| Drive Bays | 18x 2.5” hot-swap NVMe/SATA drive bays (16x 2.5” NVMe dedicated) 1 M.2 NVMe |
| Expansion Slots | 8 PCIe 5.0 x16 LP slot(s) 2 PCIe 5.0 x16 FHFL slot(s) |
| On-Board Devices | Chipset: AMD SP5 |
| Input/Output | Video: 1 VGA port(s) |
| Fans | 10 heavy duty fan(s) |
| Power Supply | 6x 3000W Redundant Titanium Level power supplies |
| System BIOS | BIOS Type: AMI 32MB SPI Flash EEPROM |
| Operating Environment | Operating Temperature: 10°C ~ 35°C (50°F ~ 95°F) Non-operating Temperature: -40°C to 60°C (-40°F to 140°F) Operating Relative Humidity: 8% to 90% (non-condensing) Non-operating Relative Humidity: 5% to 95% (non-condensing) |
| System Dimensions | Height: 14” (355.6 mm) Width: 17.2” (437 mm) Depth: 33.2” (843.28 mm) |