Breakthrough accelerated performance for giant-scale AI-HPC applications
AceleMax® AXG-AR211
- Powered by NVIDIA® Grace™ Hopper™ Superchip, offering coherent memory between CPU and GPU through NVLink®- C2C interconnect
- Optimized for memory-intensive inference and high-performance computing (HPC) applications
- Supports up to 480GB LPDDRX embedded memory and 96GB HBM3 GPU memory
- Includes a 1+1 high-efficiency, hot-plug 2000W power supply unit with 80 Plus Titanium certification
Specifications
| Specifications | Details |
|---|---|
| Processor Family | • NVIDIA GH200 Grace™ Hopper™ Superchip |
| Processor Type | • NVIDIA Grace™, 72 Arm® Neoverse V2 cores |
| Form Factor | • 2U |
| Storage | • (4) E1.S NVMe SSD |
| Memory | • Up to 480GB LPDDRX embedded • 96GB HBM3 GPU memory |
| Expansion Slot | • (3) PCIe 5.0 x16 FHFL Dual Width slots |
| Front I/O | • Power/ID/Reset Buttons • Power/ID/Status LEDs • (2) USB 3.0 ports • (1) VGA port |
| Storage Controller | • Broadcom HBA 9500 Series Storage Adaptor • Broadcom MegaRAID 9560 Series |
| Power Supply | • 1+1 High efficiency hot-plug 2000W PSU, 80 Plus Titanium |
| Onboard Storage | • (2) 22110/2280 PCIe M.2 |
| Fan | • (5) 6056 dual rotor fans (N+1 redundant) |
| Rear I/O | • (1) USB 3.0 • (1) Mini display port • (1) ID LED • (1) PWR Button/PWR LED • (1)COM Port (micro USB type-B) • (1)RJ45 mgmt port |
| Operating Environment | • Operating temperature: 5°C to 35°C • Non-operating temperature: -40°C to 70°C • Operating relative humidity: 20% to 85%RH • Non-operating relative humidity: 10% to 95%RH |
| TPM | • TPM 2.0 SPI module (optional) |
| Dimensions | • W x H x D (inch): 17.24” x 3.44” x 35.43” • W x H x D (mm): 438 x 87.5 x 900mm |